Floor structure of the drywall construction underfloor heating

For an even heat distribution and reliable function of the Floor Heating for dry construction, a suitable substrate is essential. A load-bearing, even, and dry structure, as well as the correct combination of the individual layers – from the leveling layer to the support systems to the final floor covering – are crucial.

Common Substrates

Screed/Rough ceiling

Screed:

Check evenness, if necessary, level with leveling compound

Check dryness

Raw Ceiling:

Check evenness, if necessary, level with leveling compound

Building waterproofing, if necessary

Wood beam ceiling

Check deflection, evenness, and load-bearing capacity, strengthen construction if necessary.

Fillings/Drywall Construction

Filling:

Loose filling

Bound filling

Trickle protection fleece, if required

Load distribution layer necessary! e.g.:

20 mm dry screed element

2 x 15 mm OSB board, glued and screwed

2 x 19 mm chipboard, glued and screwed

VarioComp boards on thermal/acoustic insulation boards

up to 30 mm insulation thickness

Up to an insulation thickness of 30 mm, the VarioComp board can be laid directly on thermal/impact sound insulation. The prerequisite is a sufficiently high compressive strength of the underlay boards.

VarioComp boards on thermal/acoustic insulation boards

from 30 mm insulation thickness

For installation on thermal/impact sound insulation from 30 mm, an additional load distribution layer is required.